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When transmitting electrical signals through conductors on a printed circuit board (PCB), there can be electromagnetic field emissions that may interfere with other signals in the vicinity. Electromagnetic interference (EMI) in relation to PCBs is a problem associated with the unwanted emission of electromagnetic energy from electronic components and conductors on the PCB, as well as the susceptibility of the PCB to external electromagnetic interference. The electromagnetic field from the surrounding environment or other electronic devices can impact the signal on the PCB, leading to erroneous readings or data transmission. Insufficient shielding of conductors or the lack of appropriate shielding materials can allow external electromagnetic interference to penetrate the traces on the PCB.

This time we will look at a trend that is being further developed in America in the textile company Nextiles. The company combines traditional sewing techniques with printed circuit boards to create smart fabric that enables biomechanical and biometric sensing for measurement and performance assessment. Currently, Nextiles has shifted its research to a production scale.

Moisture, steam, dust? No problem! PCB manufacturing can handle these environments too. All modern electronic devices need printed circuit boards to operate. In printed circuit boards, the circuit is printed on a non-conductive material.

The printed circuit board is the heart of any electronic device. It is important not only because it allows the electrical interconnection of various components, but also because it carries digital, analogue and high frequency signals for data transmission.

A solder mask is a protective coating on printed circuit boards that prevents oxidation. The traditional green coating you see on PCBs is a solder mask. Some circuit boards also use different colored solderless masks. The material of the solder mask can be, for example, epoxy resin. The solder mask must also be resistant to the fluxes and cleaning agents used. Resin is a good choice for a solder mask because it is durable, effective against moisture and insulates, maintains a good appearance over time, and can withstand high temperatures. In addition, it does not conduct electricity.

We will focus on design techniques that enable better thermal management. In this article, we will discuss design techniques that improve thermal management, including some common methods for removing excess heat from a printed circuit board.

The three-part series on the economics of electronic device development and manufacturing is coming to an end.

Implementing digital production means, among other things, thinking about the future. Automation is nothing new, but recently some technologies have matured - such as AI (Artificial Intelligence) or RPA (Robotic Process Automation) - that have the potential to change the way companies work. AI algorithms can save companies time, make operations easier and automate production processes.

Are you in innovation or start-ups? Do you have your own vision of selling a brand new product that includes electronic components? Perhaps terms like OEM, EMS, PCB and PCBA are confusing to you at the moment. Alternatively, you don't know who to contact to place your order. Today's article will help you navigate the terminology. Electrical engineering has technical terms just like other industries, and it's a good idea to understand the specifics to avoid misunderstandings between customers and suppliers. At the same time, we'll tell you who to approach to ensure that your expectations are met.

In the last part we discussed the activities that need to be carried out before the actual development of an electronic device begins. We defined the functional characteristics of the device and developed the mechanical, electrical and software concepts. We also analyzed the development effort, manufacturing costs, and project risks. We will now focus in detail on the development itself. But beware – much of the information you will learn today must be known and evaluated in the analysis phase.