The right choice of materials for thermal management in electronic assemblies can have a crucial impact on the stability and performance of devices. In this article, we will focus on five main groups of materials that can be used to address temperature-related issues and their application in various scenarios. Read on to discover how to make the correct choices and utilize thermal pastes, bonding materials, encapsulation resins, thermally conductive gap fillers, and phase-change materials to ensure optimal thermal performance in electronic assemblies.