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It is annoying for any designer to find out at the last minute that their product is defective. No matter how well the electronics are designed and carefully manufactured, there is still a risk of problems. Many electronic devices go through a prototyping phase, during which many errors and problems are discovered and must be resolved by their designers. However, if something goes unnoticed until the product is on the market, it can cause huge problems for the company.

When considering the design requirements for the production of sensitive computer components, it is evident that wire bonding will be challenging in such cases, particularly for surface-mounted devices. Especially in the construction of microprocessors, we encounter the direct connection of numerous terminals, and in such instances, BGA packages will be preferred. BGA packages are well-suited for the development of computer components and other computing devices.

When transmitting electrical signals through conductors on a printed circuit board (PCB), there can be electromagnetic field emissions that may interfere with other signals in the vicinity. Electromagnetic interference (EMI) in relation to PCBs is a problem associated with the unwanted emission of electromagnetic energy from electronic components and conductors on the PCB, as well as the susceptibility of the PCB to external electromagnetic interference. The electromagnetic field from the surrounding environment or other electronic devices can impact the signal on the PCB, leading to erroneous readings or data transmission. Insufficient shielding of conductors or the lack of appropriate shielding materials can allow external electromagnetic interference to penetrate the traces on the PCB.

This time we will look at a trend that is being further developed in America in the textile company Nextiles. The company combines traditional sewing techniques with printed circuit boards to create smart fabric that enables biomechanical and biometric sensing for measurement and performance assessment. Currently, Nextiles has shifted its research to a production scale.

Moisture, steam, dust? No problem! PCB manufacturing can handle these environments too. All modern electronic devices need printed circuit boards to operate. In printed circuit boards, the circuit is printed on a non-conductive material.

The printed circuit board is the heart of any electronic device. It is important not only because it allows the electrical interconnection of various components, but also because it carries digital, analogue and high frequency signals for data transmission.

A solder mask is a protective coating on printed circuit boards that prevents oxidation. The traditional green coating you see on PCBs is a solder mask. Some circuit boards also use different colored solderless masks. The material of the solder mask can be, for example, epoxy resin. The solder mask must also be resistant to the fluxes and cleaning agents used. Resin is a good choice for a solder mask because it is durable, effective against moisture and insulates, maintains a good appearance over time, and can withstand high temperatures. In addition, it does not conduct electricity.

We will focus on design techniques that enable better thermal management. In this article, we will discuss design techniques that improve thermal management, including some common methods for removing excess heat from a printed circuit board.

The three-part series on the economics of electronic device development and manufacturing is coming to an end.

Implementing digital production means, among other things, thinking about the future. Automation is nothing new, but recently some technologies have matured - such as AI (Artificial Intelligence) or RPA (Robotic Process Automation) - that have the potential to change the way companies work. AI algorithms can save companies time, make operations easier and automate production processes.