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The right choice of materials for thermal management in electronic assemblies can have a crucial impact on the stability and performance of devices. In this article, we will focus on five main groups of materials that can be used to address temperature-related issues and their application in various scenarios. Read on to discover how to make the correct choices and utilize thermal pastes, bonding materials, encapsulation resins, thermally conductive gap fillers, and phase-change materials to ensure optimal thermal performance in electronic assemblies.

PCB manufacturing is not a routine task, involving a plethora of machinery, labor, and processes. The cost of production is intricately tied to the value of materials, composite layers, and the complexity of PCB fabrication. How can you reduce the cost of your PCB without compromising its performance or introducing unnecessary complexity? We present twelve practical tips for PCB manufacturing that will help you save money when placing orders for your printed circuit boards. Consider these before making your next order.

In the modern technological environment, where innovation and rapid change are crucial, printed circuit boards hold a central place in the electronics industry. With this fast-paced dynamics, PCB prototype production becomes an integral part of the process of developing new electronic devices. Prototyping offers numerous benefits and plays a pivotal role in achieving success.

Progress in the electronics industry is moving forward rapidly, with the latest trends focusing on the development of advanced flexible printed circuit boards (FPCBs). These boards not only enable the interconnection of components in electronic devices but also possess the ability to bend, shape, and adapt to various conditions. Industrial manufacturers are striving not only to innovate the materials used in FPCB production but also to enhance manufacturing technologies to meet the increasingly demanding requirements of the modern electronic market.

In April 2023, the largest planetary probe, JUpiter ICy moons Explorer (JUICE), was successfully launched towards the largest planet in the Solar System, Jupiter.

Placement and routing are the processes of designing a printed circuit board (PCB) that involve component placement and the creation of connections between them. It is an important and critical step in PCB design. Component placement has a significant impact on the overall design schedule, while routing itself forms a smaller part of this process.

It is annoying for any designer to find out at the last minute that their product is defective. No matter how well the electronics are designed and carefully manufactured, there is still a risk of problems. Many electronic devices go through a prototyping phase, during which many errors and problems are discovered and must be resolved by their designers. However, if something goes unnoticed until the product is on the market, it can cause huge problems for the company.

When considering the design requirements for the production of sensitive computer components, it is evident that wire bonding will be challenging in such cases, particularly for surface-mounted devices. Especially in the construction of microprocessors, we encounter the direct connection of numerous terminals, and in such instances, BGA packages will be preferred. BGA packages are well-suited for the development of computer components and other computing devices.

When transmitting electrical signals through conductors on a printed circuit board (PCB), there can be electromagnetic field emissions that may interfere with other signals in the vicinity. Electromagnetic interference (EMI) in relation to PCBs is a problem associated with the unwanted emission of electromagnetic energy from electronic components and conductors on the PCB, as well as the susceptibility of the PCB to external electromagnetic interference. The electromagnetic field from the surrounding environment or other electronic devices can impact the signal on the PCB, leading to erroneous readings or data transmission. Insufficient shielding of conductors or the lack of appropriate shielding materials can allow external electromagnetic interference to penetrate the traces on the PCB.

This time we will look at a trend that is being further developed in America in the textile company Nextiles. The company combines traditional sewing techniques with printed circuit boards to create smart fabric that enables biomechanical and biometric sensing for measurement and performance assessment. Currently, Nextiles has shifted its research to a production scale.