Part 2: What not to forget when manufacturing high frequency printed circuit boards – Electrical Signals and Electromagnetic Interference

When transmitting electrical signals through conductors on a printed circuit board (PCB), there can be electromagnetic field emissions that may interfere with other signals in the vicinity. Electromagnetic interference (EMI) in relation to PCBs is a problem associated with the unwanted emission of electromagnetic energy from electronic components and conductors on the PCB, as well as the susceptibility of the PCB to external electromagnetic interference. The electromagnetic field from the surrounding environment or other electronic devices can impact the signal on the PCB, leading to erroneous readings or data transmission. Insufficient shielding of conductors or the lack of appropriate shielding materials can allow external electromagnetic interference to penetrate the traces on the PCB.

The trend of our time – smart fabrics

This time we will look at a trend that is being further developed in America in the textile company Nextiles. The company combines traditional sewing techniques with printed circuit boards to create smart fabric that enables biomechanical and biometric sensing for measurement and performance assessment. Currently, Nextiles has shifted its research to a production scale.

Part One: What to look out for when making PCBs for extreme environments?

Moisture, steam, dust? No problem! PCB manufacturing can handle these environments too. All modern electronic devices need printed circuit boards to operate. In printed circuit boards, the circuit is printed on a non-conductive material.

Economics of development and production of electronic devices Volume 3

The three-part series on the economics of electronic device development and manufacturing is coming to an end.

Economics of development and production of electronic devices - Volume 2

In the last part we discussed the activities that need to be carried out before the actual development of an electronic device begins. We defined the functional characteristics of the device and developed the mechanical, electrical and software concepts. We also analyzed the development effort, manufacturing costs, and project risks. We will now focus in detail on the development itself. But beware – much of the information you will learn today must be known and evaluated in the analysis phase.